Super Thick PCB (TS-0006)
| Negotiable | 1 Piece (MOQ) |
Min. Order:
1 Piece
Transport Package:
VACUUM
Guangdong, China
Last Login Date:
Oct 11, 2012
Business Type:
Manufacturer/Factory
Product Description
Company Info
Basic Info.
Model NO.
TS-0006
Specification
IPC-II
Origin
China
HS Code
85340090
Product Description
Thick PCB Board
Layers: 2
Base Material: FR4
Board Thickness: 3.2 MM
Copper Thickness: 35 um
Soldermask: Green
Idents: White
Finishing: Hot Air Soldering Level (Lead Free)
** RoHS Compliance.
*Fabric Capacity:
NO Item Craft Capacity
1 Layer 1-28 Layers
2 Base Material for PCB FR4, CEM-1, Aluminium, High Tg MaterialHigh FrequenceROGERS, TEFLON, TACONIC, ARLON) Halogen-free Material
3 Rang of finish baords Thickness 0.21-7.0mm
4 Max size of finish board 900MM*900MM
5 Minimum Linewidth 3mil
6 Minimum Line space 3mil
7 Min space between pad to pad 3mil
8 Minimum hole diameter 0.10 mm
9 Min bonding pad diameter 10mil
10 Max proportion of drilling hole and board thickness 1: 12.5
11 Minimum linewidth of Idents 4mil
12 Min Height of Idents 25mil
13 Finishing Treatment HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver, Gold Plating (Flash Gold), OSP, etc.
14 Soldermask Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask. 15 Minimun thickness of soldermask 10um
16 Color of silk-screen White, Black, Yellow ect.
17 E-Testing 100% E-Testing High Voltage Testing; Flying Probe Testing
18 Other test Impedance, , Testing, Resistance, , Testing, Microsection etc.,
19 Date file format GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++
20 Special technological requirement Blind & Buried Vias and High Thickness copper
Layers: 2
Base Material: FR4
Board Thickness: 3.2 MM
Copper Thickness: 35 um
Soldermask: Green
Idents: White
Finishing: Hot Air Soldering Level (Lead Free)
** RoHS Compliance.
*Fabric Capacity:
NO Item Craft Capacity
1 Layer 1-28 Layers
2 Base Material for PCB FR4, CEM-1, Aluminium, High Tg MaterialHigh FrequenceROGERS, TEFLON, TACONIC, ARLON) Halogen-free Material
3 Rang of finish baords Thickness 0.21-7.0mm
4 Max size of finish board 900MM*900MM
5 Minimum Linewidth 3mil
6 Minimum Line space 3mil
7 Min space between pad to pad 3mil
8 Minimum hole diameter 0.10 mm
9 Min bonding pad diameter 10mil
10 Max proportion of drilling hole and board thickness 1: 12.5
11 Minimum linewidth of Idents 4mil
12 Min Height of Idents 25mil
13 Finishing Treatment HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver, Gold Plating (Flash Gold), OSP, etc.
14 Soldermask Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask. 15 Minimun thickness of soldermask 10um
16 Color of silk-screen White, Black, Yellow ect.
17 E-Testing 100% E-Testing High Voltage Testing; Flying Probe Testing
18 Other test Impedance, , Testing, Resistance, , Testing, Microsection etc.,
19 Date file format GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++
20 Special technological requirement Blind & Buried Vias and High Thickness copper
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